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Intel Core i9-13950HX

The mobile processor Intel Core i9-13950HX, which was released in January 2023, features 24 cores and is priced at. It belongs to the Core i9 series and utilizes the Raptor Lake-HX architecture with BGA 1964. With Intel Hyper-Threading technology, the P-Cores’ core-count effectively doubles to a total of 32 threads. The Core i9-13950HX comes with 36 MB of L3 cache and operates at a base frequency of 2.2 GHz, with the ability to boost up to 5.5 GHz depending on the workload. Manufactured on a 10 nm production process by Intel, the transistor count remains undisclosed. Overclocking is made easier with the unlocked multiplier on the Core i9-13950HX, allowing users to adjust the frequency for optimal performance.

The Core i9-13950HX has a thermal design power of 55 W, making it energy-efficient for a contemporary personal computer. It is compatible with both DDR4 and DDR5 memory through a dual-channel interface. Additionally, it supports ECC memory, a crucial feature for ensuring data integrity in critical systems. The processor communicates with other hardware components using a PCI-Express Gen 5 connection. Integrated within the Core i9-13950HX is the UHD Graphics 770 graphics solution.

The Core i9-13950HX operates at a TDP of 55 W, which is standard for a modern PC. It is capable of utilizing DDR4 and DDR5 memory with a dual-channel interface. ECC memory is also supported, providing an essential feature for safeguarding data in mission-critical applications. To interact with other components, the Core i9-13950HX utilizes a PCI-Express Gen 5 connection. This processor is equipped with the UHD Graphics 770 integrated graphics solution.

Hardware virtualization is enabled on the Core i9-13950HX, leading to a significant enhancement in virtual machine performance. Moreover, IOMMU virtualization (PCI passthrough) is endorsed, allowing guest virtual machines to utilize host hardware directly. Applications that utilize Advanced Vector Extensions (AVX) will experience improved performance when running on this processor, especially for calculation-intensive tasks. In addition to AVX, Intel has also integrated the newer AVX2 standard, while excluding AVX-512.

Physical

Socket: Intel BGA 1964
Foundry: Intel
Process Size: 10 nm
Die Size: 257 mm²
Package: FC-BGA16F
tCaseMax: 72°C
tJMax: 100°C

Processor

Market: Mobile
Production Status: Active
Release Date: Jan 4th, 2023
Part#: SRMEB

 

Performance

Frequency: 2.2 GHz
Turbo Clock: up to 5.5 GHz
P-Core Boost 3.0: 5.5 GHz
E-Core Frequency: 1600 MHz
up to 4 GHz
Base Clock: 100 MHz
Multiplier: 22.0x
Multiplier Unlocked: Yes
TDP: 55 W
Minimum Power: 45 W
PL1: 55 W
PL2: 157 W
PL2 Tau Limit: 28 seconds

Architecture

Codename: Raptor Lake-HX
Generation: Core i9
(Raptor Lake-HX)
Memory Support: DDR4, DDR5
DDR4 Speed: 3200 MT/s
DDR5 Speed: 5600 MT/s
Memory Bus: Dual-channel
ECC Memory: Yes
PCI-Express: Gen 5, 20 Lanes
(CPU only)
Chipsets: WM790, HM770

Core Config

# of Cores: 24
# of Threads: 32
Hybrid Cores: P-Cores: 8
E-Cores: 16
SMP # CPUs: 1
Integrated Graphics: UHD Graphics 770

Cache

Cache L1: 80 KB (per core)
Cache L2: 2 MB (per core)
Cache L3: 36 MB (shared)
E-Core L1: 96 KB (per core)
E-Core L2: 4 MB (per module)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4.2
  • AVX
  • AVX2
  • FMA3
  • SHA
  • EIST
  • Intel 64
  • XD bit
  • VT-x
  • VT-d
  • AES-NI
  • TSX
  • TXT
  • CLMUL
  • F16C
  • BMI1
  • BMI2
  • ABM
  • ADX
  • RdRand
  • vPro
  • TBT 2.0
  • TBT 3.0
  • DLBoost